MWM - 300

MWM-300 Up to 12" (300mm) wafers, vacuum mounting process, programmable tape tension, PLC-controlled operation, safe for wafers down to 6 mils thick.

FEATURES

* No roller used.

* Mounts wafers up to 300mm.

* Bubble-free tape adhesion provides improved adhesion.

* Minimizes mechanical contact with wafer.

* UV Tape capability.

* Automatic motorized tape cutting.

* Tape tension is controlled and programmable.

Dimensions: (H?W?D) 70” x 35.5” x 48” (178.6 x 90 x 122 cm).

Weight: 273 lbs. (124 kg).

Line Voltage: 110-220 Vac, 60 Hz, Single Phase,

220-240 Vac, 50 Hz, Single Phase

Air Pressure: 5 bar CDA.

SPECIFICATIONS

TECHNOLOGY

Vacuum Wafer Mounter Technology 300mm wafers are delicate and expensive substrates requiring special handling care and attention.Vacuum technology provides the solution to 300mm wafer/frame mounting with minimal physical contact and mechanical force applied to the wafer.Tape application in a vacuum environment eliminates air bubbles betweenthe wafer and the tape for improved adhesion - extremely important for very thinwafer and small die dicing applications.