New!

Higher-Power UV Unit for AE UV Curing Systems.
In response to new UV tape models on the market, AE is now marketing our Higher-Power UV Unit to provide improved performance. Ask us for details.



For further information please contact us.

The AE UV-9200 is specially designed for safe and reliable processing of 6" & 8" wafers, with no contact between the operator and the wafer frame during processing. PC-controlled and based on AE's field-proven UV curing technology, the UV-9200 is easy to use and highly cost-effective to operate.

For further information please contact us.

AE has teamed up with Spirox Corporation as our Taiwan distributor in order to provide our Taiwan customers the highest level of sales and service support. Spirox's strong Taiwan network, with offices in Hsinchu, Tainan and Kaohsiung ensures that AE customers can benefit from Spirox's expert knowledge and years of experience in the semiconductor sector. Spirox dedicated sales and service personnel guide our customers in selecting the best possible AE solutions for all their dicing environment requirements.

In addition to the distributorship in Taiwan, Spirox (Shanghai) has been appointed as an official AE sales agent for China. This will facilitate easy communication with China-Taiwan joint venture projects, as well as MNCs and local companies looking for top-level back-end equipment solutions.

AE Advanced Engineering is an expert semiconductor equipment manufacturer, specializing in automatic and manual UV curing, wafer mounting and post-dicing wafer cleaning systems. AE systems are in use at the world's leading semiconductor packaging and assembly plants.


For further information please contact us.

The AE AWM-856 is a high-throughput, PC-controlled semi-automatic roller wafer mounting system. Waste tape and UV tape backing are automatically collected on windup rollers. Wafer and dicing frame are manually loaded, the operator presses the Start button on the touch screen and the rest is automatic.

The AE AWM-856 provides controlled tape tensioning and absolute minimum tape gap between mountings for maximum savings in cost-of-operation.

Options include:

  • Machine vision Theta angle alignment for precise wafer positioning.
  • Automatic offloading of mounted wafers to a dicing cassette.

Wafer ID reader for Process Log information storage.

For further information please contact us.

UV-9200 Automatic UV Curing System
Higher-Power UV Unit for AE UV Curing Systems
New AE Distributor in Taiwan
AE AWM-856 Semi-Automatic Wafer Mounting System