中文
        
Home
Products
          UV Curing
          Wafer cleaner
          Wafer Mounters
          Custom
          MHS
          Consumables
News
Contact Us
News

New! Higher-Power UV Unit for AE UV Curing Systems.

In response to new UV tape models on the market, AE is now marketing our Higher-Power UV Unit to provide improved performance.
Ask us for details.



New AE Distributor in Taiwan


AE has teamed up with Spirox Corporation as our Taiwan distributor in order to provide our Taiwan customers the highest level of sales and service support. Spirox's strong Taiwan network, with offices in Hsinchu, Tainan and Kaohsiung ensures that AE customers can benefit from Spirox's expert knowledge and years of experience in the semiconductor sector. Spirox dedicated sales and service personnel guide our customers in selecting the best possible AE solutions for all their dicing environment requirements.

In addition to the distributorship in Taiwan , Spirox (Shanghai) has been appointed as an official AE sales agent for China. This will facilitate easy communication with China-Taiwan joint venture projects, as well as MNCs and local companies looking for top-level back-end equipment solutions.

AE Advanced Engineering is an expert semiconductor equipment manufacturer, specializing in automatic and manual UV curing, wafer mounting and post-dicing wafer cleaning systems. AE systems are in use at the world's leading semiconductor packaging and assembly plants.


SEMI    MEMBER

AE Advanced Engineering is a world leader in providing Dicing Environment equipment and materials to the semiconductor industry. Known for its reliable and robust products, AE develops innovative and marker-driven systems for use in the sophisticated and highly demanding microelectronics assembly market. Constantly working with its customers to help them meet ever-evolving process requirements, AE   provides a wide range of dicing environment products: Wafer mounters, wafer cleaners, UV curing systems, dicing tapes and accessories Wafer Mounting: Finished wafers from a semiconductor fab are mounted on dicing tape and attached to dicing frames. Dicing: The frame-mounted wafer is placed in a dicing saw to be cut into individual dies. Cleaning: The diced wafer is placed in a wafer cleaning system to remove debris and micro-particles remaining on the wafer after the dicing process. UV Curing: Wafers that are mounted on UV curable dicing tape undergo a UV curing process to enable easy die removal for pick and place and die attach operations.

                                 Home        Wafer Mounters        Wafer cleaner        UV Curing        Consumables       MHS