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New Equipment Purchasing Track.

In light of recent world economic events and the current situation in the semiconductor manufacturing field, AE Advanced Engineering is now supporting our valued customers with a new equipment procurement track.

This method of payment is designed to provide financial flexibility to our customers and make equipment purchasing easier under the current tight budget conditions that exist in many companies. If your company needs to expand manufacturing capability or replace outdated machines, AE will work with you to find the financial package that makes sense for you.

Please contact your local AE distributor or AE directly, to see how we can cooperate to beat the current market conditions together.


New! Higher-Power UV Unit for AE UV Curing Systems.

In response to new UV tape models on the market, AE is now marketing our Higher-Power UV Unit to provide improved performance.
Ask us for details.


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                MHS

   MHS - Modular System

MHS - Modular System for Wafer Frames Load/Unload
Converts manual machines to fully automatic systems.
Automatic dicing frame loading/unloading from dicing cassette.
Easily retrofitted to existing manual systems.
Auto-alignment of wafer on dicing saw, does not interfere with dicing saw software.
Automatic programmable Y-axis correction.
Independent PC-controlled, does not interfere with dicing saw software.
Uses MS Windows 2000 GUI.
Accepts all cassette types up to 6” saw MHS Modular Wafer Frame Load/Unload System  Convert from Manual to Fully Automatic!
AE develops modular systems to load/unload wafer frames into dicing, pick & place, cleaners and other semiconductor manufacturing systems. AE's MHS (Modular Handling System) is designed to handle wafer frames up to 8" (200mm) and operates with standard cassettes that carry up to 25 frames. The new MHS Control System is designed to operate independently and minimizes intervention with the host system.

For further information please contact us.



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