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News

New Equipment Purchasing Track.

In light of recent world economic events and the current situation in the semiconductor manufacturing field, AE Advanced Engineering is now supporting our valued customers with a new equipment procurement track.

This method of payment is designed to provide financial flexibility to our customers and make equipment purchasing easier under the current tight budget conditions that exist in many companies. If your company needs to expand manufacturing capability or replace outdated machines, AE will work with you to find the financial package that makes sense for you.

Please contact your local AE distributor or AE directly, to see how we can cooperate to beat the current market conditions together.


New! Higher-Power UV Unit for AE UV Curing Systems.

In response to new UV tape models on the market, AE is now marketing our Higher-Power UV Unit to provide improved performance.
Ask us for details.


SEMI    MEMBER
                                                        FEATURES

Designed to attach two waers by wax adhesion. Precise alignment:               X,Y +/- 0.2mm ; f
                                  Theta +/- 1.0 Deg.
Final parallelism:   +/- 0.02mm, for all standard wafer
                                   frame sizes, up to 8”.
Temperature controlled platen.
Compact desktop design.
Manual operation.

 

  Weight:                 70 lbs. (32 kg)   

  Dimensions:        (D x W x H)    12” x 15.5” x 31.5”

                                 (30.5 x 39.5 x 80 cm).   

  Line Voltage:       110 - 120 Vac, 60 Hz, Single Phase , or  

                                 220 - 240 Vac, 50 Hz, Single Phase  

  Air Pressure:      5 bar.

                                                  SPECIFICATIONS

WAFER ATTACH SYSTEM

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